Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation
LJ Ernst (TU Delft - Computational Design and Mechanics)
Kaspar M B Jansen (TU Delft - Computational Design and Mechanics)
MK Saraswat (TU Delft - Computational Design and Mechanics)
C van t Hof (TU Delft - Dynamics of Micro and Nano Systems)
Guo-Qi Zhang (TU Delft - Computational Design and Mechanics)
DG Yang (External organisation)
HJL Bressers (External organisation)
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Abstract
In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.
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