Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations
Conference Paper
(2013)
Author(s)
P. Liu (TU Delft - Electronic Components, Technology and Materials)
J. Zhang (TU Delft - Electronic Components, Technology and Materials)
R Sokolovskij (External organisation)
Henk W. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
B.A.Z. Mimoun (TU Delft - Electronic Components, Technology and Materials)
Guo-Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/EuroSimE.2013.6529982
To reference this document use:
https://resolver.tudelft.nl/uuid:58777ea0-1fa6-4250-9491-6f7ac6c2d7a9
More Info
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Publication Year
2013
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1-6
ISBN (print)
978-1-4673-6138-5
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