R Sokolovskij

Conference paper (2)

2 records found

Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

Conference paper (2013) - P. Liu (author) , J. Zhang (author) , R Sokolovskij (author) , Henk W. van Zeijl (author) , B.A.Z. Mimoun (author) , Guo-Qi Zhang (author)

Advanced LED package with temperature sensors and microfluidic cooling

Conference paper (2013) - H Ye (author) , Henk W. van Zeijl (author) , R Sokolovskij (author) , AWJ Gielen (author) , Guo-Qi Zhang (author)