Copper electroplating for 3D interconnects
Conference Paper
(2006)
Author(s)
M Saadaoui (TU Delft - Old - EWI Sect. ECTM)
W.H.A. Wien (TU Delft - Electronic Components, Technology and Materials)
H.W. Van Zeijl (TU Delft - Electronic Components, Technology and Materials)
Pasqualina Maria Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Old - EWI Sect. ECTM
To reference this document use:
https://resolver.tudelft.nl/uuid:58c3d888-0523-4dfe-9b12-127279d62944
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Publication Year
2006
Research Group
Old - EWI Sect. ECTM
Pages (from-to)
523-526
ISBN (print)
90-73461-44-8
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