Continuous deep reactive ion etching of tapered via holes for three-dimensional integration
Journal Article
(2008)
Author(s)
R Li (TU Delft - Old - EWI Sect. ECTM)
Y Lamy (External organisation)
WFA Besling (External organisation)
F Roozeboom (External organisation)
Pasqualina Maria Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Old - EWI Sect. ECTM
To reference this document use:
https://resolver.tudelft.nl/uuid:5e66080c-35a8-452d-a63d-20c22ec95846
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Publication Year
2008
Research Group
Old - EWI Sect. ECTM
Issue number
125023
Volume number
8
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