A Test Structure for Analyzing Self-Heating Induced Distortion in On-Chip Current Sensing Resistors

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A Test Structure for Analyzing Self-Heating Induced Distortion in On-Chip Current Sensing Resistors

Conference Paper (2025)

Author(s)

H. Ma (TU Delft - Electronic Components, Technology and Materials)

Shoubhik Karmakar (TU Delft - Electronic Instrumentation)

H. Zhang (TU Delft - Electronic Components, Technology and Materials)

Yuyan Liu (TU Delft - Electronic Components, Technology and Materials)

H Guo (ams OSRAM)

M. Berkhout (Monolithic Power Systems (MPS))

Qinwen Fan (TU Delft - Electronic Components, Technology and Materials)

Research Group

Electronic Components, Technology and Materials

DOI related publication

https://doi.org/10.1109/ICMTS63811.2025.11068913

Microelectronics Sensors Diffusion Self-heating Distortion Resistance Kelvin Distortion Temperature sensors System-on-chip Resistors Current sensing Sensor arrays Power amplifiers Kelvin connection

To reference this document use:

https://resolver.tudelft.nl/uuid:646f8ec5-61f2-4d6f-97e0-90f7ebfcddc4

More Info

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Publication Year

2025

Language

English

Research Group

Electronic Components, Technology and Materials

Bibliographical Note

Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.@en

Pages (from-to)

1-5

ISBN (print)

979-8-3315-3170-6

ISBN (electronic)

979-8-3315-3169-0

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Abstract

This paper presents a test structure for a 27 mΩ diffusion current sensing resistor, designed to analyze distortion caused by self-heating in audio power amplifiers. A parallel Kelvin connection minimizes parasitic effects, reducing resistance error to 0.4% and temperature coefficient error to 0.7%. A diode-based temperature sensor array enables accurate measurement of temperature variations, allowing the characterization of HD3 with an inaccuracy of

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