Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
Conference Paper
(2012)
Author(s)
F Santagata (TU Delft - Electronic Components, Technology and Materials)
G. Fiorentino (TU Delft - Electronic Components, Technology and Materials)
M Nie (TU Delft - Electronic Components, Technology and Materials)
C. Farriciello (TU Delft - Electronics)
Rene Poelma (TU Delft - Electronic Components, Technology and Materials)
GQ Zhang (External organisation)
Lina Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:6ad6f3b9-2496-4a43-891e-669acf8d914a
More Info
expand_more
expand_more
Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
668-671
No files available
Metadata only record. There are no files for this record.