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CF
C. Farriciello
2 records found
1
Authored
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
Journal article (2013) -
F. Santagata
,
C. Farriciello
,
G. Fiorentino
,
H.W. van Zeijl
,
C. Silvestri
,
GQ Zhang
,
Pasqualina M Sarro
Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
Conference paper (2012) -
F. Santagata
,
G. Fiorentino
,
M. Nie
,
C. Farriciello
,
René H. Poelma
,
GQ Zhang
,
Pasqualina M Sarro
