Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
Journal Article
(2013)
Author(s)
Fabio Santagata (TU Delft - Electronic Components, Technology and Materials)
C. Farriciello (TU Delft - Electronics)
G Fiorentino (TU Delft - Electronic Components, Technology and Materials)
Henk W. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
Cinzia Silvestri (TU Delft - Electronic Components, Technology and Materials)
GQ Zhang (External organisation)
Pasqualina M. Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1088/0960-1317/23/5/055014
To reference this document use:
https://resolver.tudelft.nl/uuid:b0fcab07-201b-424f-9f7e-564ec0a1f8ab
More Info
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Publication Year
2013
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
5
Volume number
23
Pages (from-to)
1-10
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