Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

Review (2019)
Author(s)

Yue Sun (TU Delft - Electronic Components, Technology and Materials)

Xuanwu Kang (Chinese Academy of Sciences)

Yingkui Zheng (Chinese Academy of Sciences)

Jiang Lu (Chinese Academy of Sciences)

Xiaoli Tian (Chinese Academy of Sciences)

Ke Wei (Chinese Academy of Sciences)

Hao Wu (Chinese Academy of Sciences)

Wenbo Wang

Xinyu Liu (Chinese Academy of Sciences)

Guo Qi Z Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2019 Y. Sun, Xuanwu Kang, Yingkui Zheng, Jiang Lu, Xiaoli Tian, Ke Wei, Hao Wu, Wenbo Wang, Xinyu Liu, Kouchi Zhang
DOI related publication
https://doi.org/10.3390/electronics8050575
More Info
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Publication Year
2019
Language
English
Copyright
© 2019 Y. Sun, Xuanwu Kang, Yingkui Zheng, Jiang Lu, Xiaoli Tian, Ke Wei, Hao Wu, Wenbo Wang, Xinyu Liu, Kouchi Zhang
Research Group
Electronic Components, Technology and Materials
Issue number
5
Volume number
8
Pages (from-to)
1-15
Reuse Rights

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Abstract

Gallium nitride (GaN)-based vertical power Schottky barrier diode (SBD) has demonstrated outstanding features in high-frequency and high-power applications. This paper reviews recent progress on GaN-based vertical power SBDs, including the following sections. First, the benchmark for GaN vertical SBDs with different substrates (Si, sapphire, and GaN) are presented. Then, the latest progress in the edge terminal techniques are discussed. Finally, a typical fabrication flow of vertical GaN SBDs is also illustrated briefly.