Diagnosis Methodology for STT-MRAM

Defect Identification and Classification

Master Thesis (2023)
Author(s)

A. Aouichi (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Contributor(s)

S Hamdioui – Mentor (TU Delft - Computer Engineering)

M. Taouil – Mentor (TU Delft - Computer Engineering)

C. Gao – Graduation committee member (TU Delft - Electronics)

W. Kim – Mentor (IMEC)

S. Rao – Mentor (IMEC)

Faculty
Electrical Engineering, Mathematics and Computer Science
Copyright
© 2023 Ahmed Aouichi
More Info
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Publication Year
2023
Language
English
Copyright
© 2023 Ahmed Aouichi
Graduation Date
07-11-2023
Awarding Institution
Delft University of Technology
Programme
['Computer Engineering']
Faculty
Electrical Engineering, Mathematics and Computer Science
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Abstract

This thesis focuses on identifying and classifying defects in STT-MRAM technology using novel and machine learning approaches. The thesis discusses the basic principles of STT-MRAM and the semiconductor chip manufacturing process and test stages. The research aims to develop novel methods and explore machine-learning approaches to diagnose defects in STT-MRAM devices. The current defect identification methodologies have shown certain cost, speed, and scalability limitations. The thesis presents DAT-based and ML-based Diagnosis methodologies to identify and classify STT-MRAM unique defects to address these challenges. The methods are evaluated and validated on experimental wafers performed at IMEC in Leuven, Belgium.

DAT-based Diagnosis involves automated defect identification in STT-MRAM based on identifying features automatically extracted from specialized measurements targeting the unique defects, Pinhole, Intermediate State, SAF Flip, and Back-Hopping. ML-based Diagnosis uses machine learning techniques to classify defects using MTJ features extracted from low-cost measurements. Data collected from electrical measurements on experimental STT-MRAM devices serve as the basis for evaluating the developed methodologies. The thesis also discusses data analysis, including data visualization, feature correlations, and outlier analysis for future research. Furthermore, a machine learning training process is performed, including hyperparameter optimization and evaluation using F-score and B-accuracy metrics to assess the model's performance and the ability to generalize on unseen data.

DAT-based Diagnosis aims to maximize the defect detection accuracy at the expense of measurement costs. In contrast, ML-based Diagnosis minimizes the measurement cost while maximizing the detection accuracy for robust and balanced classification. However, the DAT-based Diagnosis is not verified using PFA to validate the defect types identified by the developed methodology. Furthermore, the ML-based Diagnosis uses training data labeled by the unverified DAT-based Diagnosis approach to train machine learning models. Despite these limitations, the results have shown valuable insights into defect identification and classification, proving a robust framework for diagnosing STT-MRAM devices. Additionally, a scientific paper is submitted on march-based diagnosis, adapting the DAT-based Diagnosis method to industrial chips that are limited in extracting the identifying features.

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