A combined vertical interconnect/underfill process for high density I/O flip chip bonding
W. jiao (TU Delft - Electrical Engineering, Mathematics and Computer Science)
G.Q. Zhang – Mentor (TU Delft - Electronic Components, Technology and Materials)
Xinrui Ji – Graduation committee member (TU Delft - Electronic Components, Technology and Materials)
H.W. van Zeijl – Graduation committee member (TU Delft - Electronic Components, Technology and Materials)
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Abstract
This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as underfill layer. Adhesion of sample is extensively enhanced. Various bonding methods are developed including using AML bonder and Tresky pick-and-place bonder. Electrical measurements for sintered nanoCu interconnect are conducted, sheet resistance and contact resistance are studied.