Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

Vollebregt, S.; Ishihara, R.; Derakhshandeh, J; van der Cingel, J.; Schellevis, H.; Beenakker, C.I.M.

Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

Conference paper (2011)

Authors

S. Vollebregt Electronic Components, Technology and Materials -

R. Ishihara Electronic Components, Technology and Materials -

J Derakhshandeh External organisation

J. van der Cingel Electronic Components, Technology and Materials -

H. Schellevis Electronic Components, Technology and Materials -

C.I.M. Beenakker Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2011

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials