Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

Vollebregt, Sten; Ishihara, R.; Derakhshandeh, J; van der Cingel, J.; Schellevis, H; Beenakker, C.I.M.

Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

Conference paper (2011)

Authors

Sten Vollebregt Electronic Components, Technology and Materials

R. Ishihara Electronic Components, Technology and Materials

J Derakhshandeh External organisation

J. van der Cingel Electronic Components, Technology and Materials

H Schellevis Electronic Components, Technology and Materials

C.I.M. Beenakker Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2011

Language

English

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Research Group

Electronic Components, Technology and Materials

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