Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology
Conference Paper
(2011)
Authors
S Vollebregt (TU Delft - Electronic Components, Technology and Materials)
R Ishihara (TU Delft - Electronic Components, Technology and Materials)
J Derakhshandeh (External organisation)
J van der Cingel (TU Delft - Electronic Components, Technology and Materials)
H. Schellevis (TU Delft - Electronic Components, Technology and Materials)
CIM Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://doi.org/10.1109/NANO.2011.6144393
TU Delft Repository resolver:
https://resolver.tudelft.nl/784b3240-e3b4-4fe5-8dc7-91106ed14a85
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Publication Year
2011
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
985-990
ISBN (print)
978-1-4577-1515-0
DOI:
https://doi.org/10.1109/NANO.2011.6144393
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