Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder

Jin, T.

Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder

Master thesis (2017)

Authors

T. Jin Electrical Engineering, Mathematics and Computer Science

Contributors

Guo-Qi Zhang (mentor)

Kaspar M B Jansen (graduation committee member)

R H. Poelma (graduation committee member)

M.T.W. de Langen (graduation committee member)

Faculty

Electrical Engineering, Mathematics and Computer Science, Electrical Engineering, Mathematics and Computer Science

Reliability Microstructure Au-Sn Solder Cooling rate

To reference this document use:

http://resolver.tudelft.nl/uuid:7bbb41c6-7e79-44fc-9901-377f739e2a0d

More Info

expand_more

Published Date

24-10-2017

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Abstract

Reliability is one of the major research topics of modern electronic packaging technology. The characterization of Au-Sn dia-attach solder material properties, including viscoplastic properties is requested for fast and accurate reliability assessment by industry. In this thesis, a detailed experimental based methodology to characterize Au-Sn solder's viscoplastic properties, including raw material introduction, test specimen preparation, shear creep experiments and test data analyze is provided. Furthermore, a study of microstructure effect on Au-Sn solder viscoplastic performance by experiments and following reliability analysis is presented.

Files

Delft_University_of_Technology... (pdf)

(pdf | 9.78 Mb)

License info not available