A novel micromachining process using pattern transfer over large topography for RF silicon technology

Conference paper (2000)

Authors

PN Pham Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
TK Ng Old - EWI Ch. Integrated Sensing Devices
R Behzad External organisation
JN Burghartz Old - EWI Ch. Integrated Sensing Devices
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2000

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials