Shellcase-type wafer-level packaging solutions: RF characterization and modeling

Conference paper (2004)

Authors

M. Bartek Old - EWI Ch. Integrated Sensing Devices

G Zilber External organisation

D Teomin External organisation

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

A Poliakov Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

More Info

expand_more

To reference this document use:

http://resolver.tudelft.nl/uuid:8aa64eb9-cc32-492d-84c8-5ebecac80aef

Published Date

2004

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Ch. Integrated Sensing Devices