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Conference paper (2)

2 records found

1

Wafer-level chip-scale packaging for low-end RF products

Conference paper (2004) - M. Bartek (author) , G Zilber (author) , D Teomin (author) , A Poliakov (author) , SM Sinaga (author) , P Mendes (author) , JN Burghartz (author)

Shellcase-type wafer-level packaging solutions: RF characterization and modeling

Conference paper (2004) - M Bartek (author) , G Zilber (author) , D Teomin (author) , SM Sinaga (author) , A Poliakov (author) , JN Burghartz (author)