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D Teomin
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2 records found
Shellcase-type wafer-level packaging solutions: RF characterization and modeling
Conference paper -
M. Bartek
,
G Zilber
,
D Teomin
,
SM Sinaga
,
A Poliakov
,
JN Burghartz
Wafer-level chip-scale packaging for low-end RF products
Conference paper -
M. Bartek
,
G Zilber
,
D Teomin
,
A Poliakov
,
SM Sinaga
,
P Mendes
,
JN Burghartz