Wafer-level chip-scale packaging for low-end RF products
Conference Paper
(2004)
Author(s)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
G Zilber (External organisation)
D Teomin (External organisation)
A Poliakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
SM Sinaga (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
P Mendes (TU Delft - Electronic Components, Technology and Materials)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:df690c50-2c9f-4f01-b04e-14edcfff4633
More Info
expand_more
expand_more
Publication Year
2004
Research Group
Old - EWI Ch. Integrated Sensing Devices
Bibliographical Note
ed. is niet bekend@en
Pages (from-to)
41-44
ISBN (print)
0-7803-8703-1
No files available
Metadata only record. There are no files for this record.