Numerical modeling of warpage induced in QFN array molding process

Journal Article (2007)
Author(s)

D Yang (TU Delft - Computational Design and Mechanics)

Kasper Jansen (TU Delft - Computational Design and Mechanics)

Leo Ernst (TU Delft - Computational Design and Mechanics)

G. Zhang (TU Delft - Computational Design and Mechanics)

Willem van Driel (TU Delft - Dynamics of Micro and Nano Systems)

HJL Bressers (External organisation)

JHJ Janssen (External organisation)

Research Group
Computational Design and Mechanics
More Info
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Publication Year
2007
Research Group
Computational Design and Mechanics
Volume number
47
Pages (from-to)
310-318

Abstract

Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer , the equilibrium moduli are modeled with a model based on scaling analysis and the relaxation behavior of the transient part is described by the cure-dependent relaxation amplitude and reduced relaxation times which are based on the time-conversion superposition principle. The cure-dependent parameters are characterized by using an integrated approach of dynamical mechanical analysis (DMA) and differential scanning calorimetry (DSC) measurements. Finite element modeling is carried out for three configurations of a carrier package during the curing process has significant contribution on the toal warpage of the map.

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