Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate
Journal Article
(2015)
Author(s)
Y. Liu (TU Delft - Electronic Components, Technology and Materials)
F Sun (External organisation)
L Luo (External organisation)
CA Yuan (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1007/s11664-015-3774-9
To reference this document use:
https://resolver.tudelft.nl/uuid:98216754-a54e-46a7-8abc-ce747eb76216
More Info
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Publication Year
2015
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
7
Volume number
44
Pages (from-to)
2450-2457
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