F Sun

info

Please Note

<p>This page displays the records of the person named above and is not linked to a unique person identifier. This record may need to be merged to a profile.</p>

Journal article (2)

2 records found

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal article (2014) - Y Liu , SYY Leung , J Zhao , CKY Wong , CA Yuan , GQ Zhang , F Sun , L Luo

Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

Journal article (2014) - Y Liu , J Zhao , CCA Yuan , GQ Zhang , F Sun