Impact of mid-bond testing in 3D stacked ICs
Conference Paper
(2013)
Author(s)
Mottaqiallah Taouil (TU Delft - Computer Engineering)
S. Hamdioui (TU Delft - Computer Engineering)
EJ Marinissen (External organisation)
S Bhawmik (External organisation)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:a72a1ea6-e8b7-4259-88da-42c9397386c1
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Publication Year
2013
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-6
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