A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

Conference paper (2006)

Authors

H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
J Su External organisation
SL Paalvast Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
J. van Eijk Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Elektrotechniek Techniek
More Info
expand_more

Published Date

2006

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials