Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Conference paper (1998)

Authors

AJ Kalkman QN/Fysics of NanoElectronics
A.H. Verbruggen QN/Fysics of NanoElectronics
G.C.A.M. Janssen OLD Metals Processing, Microstructures and Properties
JP Lokker QN/Fysics of NanoElectronics
S Radelaar OLD Metals Processing, Microstructures and Properties
Research Group
QN/Fysics of NanoElectronics
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Published Date

1998

Language

Undefined/Unknown

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Research Group

QN/Fysics of NanoElectronics