High-temperature bulge-test setup for mechanical testing of free-standing thin films

Transient creep in free-standing thin polycrystalline aluminum films

High-temperature tensile tests and activation volume measurement of free-standing submicron Al films

Young's modulus measurements and grain boundary sliding in free-standing thin metal films.

Stress relaxation and creep in free-standing thin aluminium films studied using a bulge tester.

A novel bulge-testing setup for rectangular free-standing thin flims.

A novel bulge-testing set-up for tensile testing of micromachined rectangular free-standing thin films.

Electromigration and diffusion in short Al-Ni-Cr lines

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Resistance Changes Induced by the Formation of a Single Void/Hillock During Electromigration

Report on mechanical and electrical reliability of AlNiCr

Mechanical behaviour during thermal cycling of AIVPd line patterns

SiOFx and SiO2 deposition in an ECR-HDP reactor: Tool characterisation and film analysis

Trenchfill with SiOF, electrical results

Electromigration in short Al lines studied by high-resolution resistance measurement

Kinetics of Cu segregation in AlCu (1%) submicron interconnects studied by resistance measurements

Trenchfill with SiOF, uniformity of properties of interest over the wafer

Far-infrared pump-probe measurement of the lifetime of the 2p(-1) shallow donor level in n-GaAs

Stress-voiding and Relaxation in single level thermally aged Al Alloys

Report on electromigration- and stress migration properties of AlSi VPd alloys