21 records found
1
High-temperature bulge-test setup for mechanical testing of free-standing thin films
High-temperature tensile tests and activation volume measurement of free-standing submicron Al films
Transient creep in free-standing thin polycrystalline aluminum films
Young's modulus measurements and grain boundary sliding in free-standing thin metal films.
Stress relaxation and creep in free-standing thin aluminium films studied using a bulge tester.
A novel bulge-testing set-up for tensile testing of micromachined rectangular free-standing thin films.
A novel bulge-testing setup for rectangular free-standing thin flims.
Electromigration and diffusion in short Al-Ni-Cr lines
Resistance Changes Induced by the Formation of a Single Void/Hillock During Electromigration
Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines
SiOFx and SiO2 deposition in an ECR-HDP reactor: Tool characterisation and film analysis
Kinetics of Cu segregation in AlCu (1%) submicron interconnects studied by resistance measurements
Trenchfill with SiOF, electrical results
Trenchfill with SiOF, uniformity of properties of interest over the wafer
Report on mechanical and electrical reliability of AlNiCr
Electromigration in short Al lines studied by high-resolution resistance measurement
Mechanical behaviour during thermal cycling of AIVPd line patterns
Report on electromigration- and stress migration properties of AlSi VPd alloys
Current dependence of reversible electromigration induced resistance changes in short Al lines and interpretation of irreversible effects
Stress-voiding and Relaxation in single level thermally aged Al Alloys
