High-temperature bulge-test setup for mechanical testing of free-standing thin films

Transient creep in free-standing thin polycrystalline aluminum films

High-temperature tensile tests and activation volume measurement of free-standing submicron Al films

Young's modulus measurements and grain boundary sliding in free-standing thin metal films.

A novel bulge-testing setup for rectangular free-standing thin flims.

Stress relaxation and creep in free-standing thin aluminium films studied using a bulge tester.

A novel bulge-testing set-up for tensile testing of micromachined rectangular free-standing thin films.

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Electromigration and diffusion in short Al-Ni-Cr lines

Resistance Changes Induced by the Formation of a Single Void/Hillock During Electromigration

Trenchfill with SiOF, electrical results

Report on mechanical and electrical reliability of AlNiCr

Electromigration in short Al lines studied by high-resolution resistance measurement

Kinetics of Cu segregation in AlCu (1%) submicron interconnects studied by resistance measurements

Mechanical behaviour during thermal cycling of AIVPd line patterns

Trenchfill with SiOF, uniformity of properties of interest over the wafer

SiOFx and SiO2 deposition in an ECR-HDP reactor: Tool characterisation and film analysis

Stress-voiding and Relaxation in single level thermally aged Al Alloys

Far-infrared pump-probe measurement of the lifetime of the 2p(-1) shallow donor level in n-GaAs

Report on electromigration- and stress migration properties of AlSi VPd alloys