Low gap superconducting single photon detectors for infrared sensitivity

Low-frequency noise in Josephson junctions for superconducting qubits

Resistance of superconducting nanowires connected to normal-metal leads

High-temperature bulge-test setup for mechanical testing of free-standing thin films

The resistive transition of aluminium hot electron bolometer mixers with normal metal cooling banks

High-temperature tensile tests and activation volume measurement of free-standing submicron Al films

Transient creep in free-standing thin polycrystalline aluminum films

Young's modulus measurements and grain boundary sliding in free-standing thin metal films.

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Magnetoresistance fluctuations in short n-type Si/SiGe heterostructure wires.

Deformation Mechanism in the Forcefill Process.

Multiprobe resistance monitoring of Blech pattern during electromigration testing.

A novel bulge-testing set-up for tensile testing of micromachined rectangular free-standing thin films.

Micron-sized hall probes on a Si/SiGe heterostructure as a tool study vortex dynamics in high-temperature superconducting crystals.

An experimental study on magnetoresistance phenomena in n-type Si/SiGe quantum wires.

A novel bulge-testing setup for rectangular free-standing thin flims.

Plasma induced charging damage of gate oxides.

Electromigration eliability study of a GMR spin valve device, Materials Reliability in Microelectronics IX.

Mechanism for forcefill.

Stress relaxation and creep in free-standing thin aluminium films studied using a bulge tester.