Investigation on flip chip solder joint fatigue with cure-dependent underfill properties
Journal Article
(2003)
Author(s)
DG Yang (External organisation)
GQ Zhang (External organisation)
Leo Ernst (TU Delft - Dynamics of Micro and Nano Systems)
C van t Hof (TU Delft - Dynamics of Micro and Nano Systems)
JFJM Caers (External organisation)
HJL Bressers (External organisation)
JHJ Janssen (External organisation)
Research Group
Dynamics of Micro and Nano Systems
To reference this document use:
https://resolver.tudelft.nl/uuid:c03687c3-dfd8-4769-a943-38b15a85d4c3
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Publication Year
2003
Research Group
Dynamics of Micro and Nano Systems
Issue number
2
Volume number
26
Pages (from-to)
388-398
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