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JFJM Caers
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Authored
2 records found
Solders fatigue prediction using interfacial boundary volume criterion
Conference paper -
XJ Zhao
,
GQ Zhang
,
JFJM Caers
,
L.J. Ernst
Investigation on flip chip solder joint fatigue with cure-dependent underfill properties
Journal article -
DG Yang
,
GQ Zhang
,
L.J. Ernst
,
C van t Hof
,
JFJM Caers
,
HJL Bressers
,
JHJ Janssen