JFJM Caers | TU Delft Repository

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JFJM Caers

Conference paper (1)

Journal article (1)

2 records found

1

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Journal article (2003) - DG Yang (author) , GQ Zhang (author) , Leo Ernst (author) , C van t Hof (author) , JFJM Caers (author) , HJL Bressers (author) , JHJ Janssen (author)

Solders fatigue prediction using interfacial boundary volume criterion

Conference paper (2002) - XJ Zhao (author) , GQ Zhang (author) , JFJM Caers (author) , L.J. Ernst (author)