Monolithic 3D Wafer Level Integration

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doi:10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

Monolithic 3D Wafer Level Integration

Applied for Smart LED Wafer Level Packaging

Doctoral Thesis (2017)

Author(s)

Zahra Kolahdouz Esfahani (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Contributor(s)

Guo Qi Zhang – Promotor (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Henk van Zeijl – Copromotor (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group

Electronic Components, Technology and Materials

LED System-in-Package 3D wafer-level integration High aspect ratio lithography Multi-step imaging Smart silicon interposer Side-wall photodiode Blue/UV selective photodetector Sensor readout BiCMOS process Wafer-level optic Multidisciplinary simulation Optical simulation

DOI related publication

https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca Final published version

To reference this document use

https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

More Info

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Publication Year

2017

Language

English

Research Group

Electronic Components, Technology and Materials

ISBN (print)

978-94-028-0513-0

Downloads counter

421

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