A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes

Conference Paper (2017)
Author(s)

E. Kang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Q. Ding (TU Delft - Electrical Engineering, Mathematics and Computer Science)

M. Shabanimotlagh (ImPhys/Acoustical Wavefield Imaging )

P. Kruizinga (Erasmus MC)

Z.Y. Chang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

E. Noothout (ImPhys/Acoustical Wavefield Imaging )

H.J. Vos (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

J.G. Bosch (Erasmus MC)

M.D. Verweij (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

N. de Jong (ImPhys/Acoustical Wavefield Imaging , Erasmus MC)

M.A.P. Pertijs (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Instrumentation
DOI related publication
https://doi.org/10.1109/esscirc.2017.8094563 Final published version
More Info
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Publication Year
2017
Language
English
Research Group
Electronic Instrumentation
Pages (from-to)
211-214
ISBN (electronic)
978-1-5090-5025-3
Event
ESSDERC-ESSCIRC 2017 (2017-09-11 - 2017-09-14), Leuven, Belgium
Downloads counter
285

Abstract

Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a
high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.