This work demonstrates the design, fabrication, and characterization of the first piezoelectric micromachined ultrasonic transducers (PMUTs) based on bilayer X-cut lithium niobate (LiNbO3). A comparison of PMUT materials based on different figures of merit (FoMs) is presented, highlighting LiNbO3 as a promising and well-balanced alternative to more conventional materials. To leverage its superior material properties, PMUTs were designed based on bilayer X-cut LiNbO3 to fully harnesses the in-plane stress associated with the bending of the structure, thereby enhancing transduction. The fabricated devices show high electromechanical coupling (k2t ) of 4:6 %, albeit significantly lower than the simulated value due to parasitic effects. Mechanical vibration characterization shows a high static displacement of 0:88 nm=V and excellent linear dynamic range. Based on this design, an 8 × 1 array is demonstrated showing excellent consistency among the elements, with a frequency spread of 0:006 MHz and a displacement sensitivity spread of 0:15 nm=V. Our devices show comparable performance to monocrystalline PZT-based PMUTs, and substantially outperform ScAlN-based PMUTs in terms of static displacement sensitivity by a factor of 5. These results underscore the strong potential of LiNbO3 for high-performance PMUTs.

IN [1], there is a mistake in the timing diagram shown in Fig. 6. Switches S 1-S 4 are skipping some of the samples and the rate at which they are operating implies a TDM rate of 10 MHz, whereas (as described in [1]) this should be 20 MHz. In the updated Fig. 6, S 1-S 4 have been updated and a minor change has been made to the timing shown for switches Q₁ and Q₂, such that the correct TDM rate is indicated and no sample provided to the S/H stage via N1-N4 is skipped in the diagram. (Figure presented).

This work identifies the optimal orientation of lithium niobate (LiNbO3, LN) for piezoelectric micromachined ultrasonic transducers (PMUTs) operating in lateral-field excitation (LFE) and thickness-field excitation (TFE) modes. Geometry-independent material figures of merit (FoMs), representing the round-trip signal-to-noise ratio (SNR), are evaluated by sweeping rotated material tensors across the full orientation space. Finite element method (FEM) simulation is then used to quantify the electromechanical coupling k_t² under consistent device stacks and electrode layouts. The FoMs peak at 140°Y-cut LiNbO3 (≈120% of PZT-5H); the best commercial TFE option, 128°Y-cut, attains ~65% of that maximum. Under the shared baseline design, the highest k_t² is achieved with X-cut LiNbO3 (≈7.2%) using elongated rectangular membranes, about 70% of the PZT-5H reference. Our results provide clear design guidance for LiNbO3 PMUTs to maximize performance: optimal cut, in-plane rotation, and membrane geometry.

Emerging handheld and wearable ultrasound devices enable diagnosis and long-term monitoring outside clinical settings. They require a low-power, highly complex, locally integrated system to process the RF data. The analog-to-digital converter (ADC) is a critical building block in the receive chain of these systems as it enables digital beamforming and image reconstruction. However, the ADCs currently used in cart-based imaging systems are bulky and consume too much power to be integrated into battery-powered devices. This article investigates how the area and power consumption of the commonly used successive approximation register (SAR) ADC can be reduced without negatively affecting B-mode and color-Doppler image quality. A Monte Carlo (MC) simulation study was performed in which RF data acquired with a phased-array transducer in Field II were digitized using a model of a nonideal ADC. Five different nonidealities were applied to four commonly used SAR-ADC architectures. B-mode and color-Doppler images were reconstructed from the digitized RF data. The impact of the nonidealities on the image quality was evaluated by means of three image quality metrics (IQM): peak signal-to-noise ratio (PSNR), structural similarity index (SSIM), and contrast-to-noise ratio (CNR). The effectiveness of error correction and ways of calibration are also discussed. The results show that both B-mode imaging and color-Doppler imaging are inherently resilient to nonidealities, particularly capacitor mismatch, leading to relaxed ADC requirements and paving the way for more practical in-probe digitization.

This article presents an application-specific integrated circuit (ASIC) for catheter-based 3-D ultrasound imaging probes. The pitch-matched design implements a comprehensive architecture with high-voltage (HV) transmitters, analog front ends, hybrid beamforming analog-To-digital converters (ADCs), and data transmission to the imaging system. To reduce the number of cables in the catheter while maintaining a small footprint per element, transmission (TX) beamforming is realized on the chip with a combination of a shift register (SR) and a row/column (R/C) approach. To explore an additional cable-count reduction in the receiver part of the design, a channel with a combination of time-division multiplexing (TDM), subarray beamforming, and multi-level pulse amplitude modulation (PAM) data transmission is also included. This achieves an 18-fold cable-count reduction and minimizes the power consumption in the catheter by a load modulation (LM) cable driver. It is further explored how common-mode interference can limit beamforming gain and a strategy to reduce its impact with local regulators is discussed. The chip was fabricated in TSMC 0.18-m HV BCD technology and a 2-D PZT transducer matrix of 16 × 18 elements with a pitch of 160 m and a center frequency of 6 MHz was manufactured on the chip. The system can generate all required TX patterns at up to 30 V, provides quick settling after the TX phase, and has an reception (RX) power consumption of only 1.12 mW/element. The functionality and operation of up to 1000 volumes/s have been demonstrated in electrical and acoustic imaging experiments.

This article presents a pitch-matched transceiver application-specific integrated circuit (ASIC) for a wearable ultrasound device intended for transfontanelle ultrasonography, which includes element-level 20-V unipolar pulsers with transmit (TX) beamforming, and receive (RX) circuitry that combines eightfold multiplexing, four-channel micro-beamforming (?BF), and subgroup-level digitization to achieve an initial 32-fold channel-count reduction. The ?BF is based on passive boxcar integration, merged with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering (AAF) and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link, based on 16-level pulse-amplitude modulation, concatenates the outputs of four ADCs, providing an overall 128-fold channel-count reduction. A prototype transceiver ASIC was fabricated in a 180-nm BCD technology, and interfaces with a 2-D PZT transducer array of 16 × 16 elements with a pitch of 125 ?m and a center frequency of 9 MHz. The ASIC consumes 1.83 mW/element. The data link achieves an aggregate 3.84 Gb/s data rate with 3.3 pJ/bit energy efficiency. The ASIC's functionality has been demonstrated through electrical, acoustic, and imaging experiments.

Objective: Described here is the development of an ultrasound matrix transducer prototype for high-frame-rate 3-D intra-cardiac echocardiography. Methods: The matrix array consists of 16 × 18 lead zirconate titanate elements with a pitch of 160 µm × 160 µm built on top of an application-specific integrated circuit that generates transmission signals and digitizes the received signals. To reduce the number of cables in the catheter to a feasible number, we implement subarray beamforming and digitization in receive and use a combination of time-division multiplexing and pulse amplitude modulation data transmission, achieving an 18-fold reduction. The proposed imaging scheme employs seven fan-shaped diverging transmit beams operating at a pulse repetition frequency of 7.7 kHz to obtain a high frame rate. The performance of the prototype is characterized, and its functionality is fully verified. Results: The transducer exhibits a transmit efficiency of 28 Pa/V at 5 cm per element and a bandwidth of 60% in transmission. In receive, a dynamic range of 80 dB is measured with a minimum detectable pressure of 10 Pa per element. The element yield of the prototype is 98%, indicating the efficacy of the manufacturing process. The transducer is capable of imaging at a frame rate of up to 1000 volumes/s and is intended to cover a volume of 70° × 70° × 10 cm. Conclusion: These advanced imaging capabilities have the potential to support complex interventional procedures and enable full-volumetric flow, tissue, and electromechanical wave tracking in the heart.

While medical imaging using ultrasound is an established field, technical advances are enabling a range of new-use cases and associated new ultrasound imaging devices. Examples include catheters capable of providing real-time 3D images to guide minimally invasive interventions and wearable devices for new monitoring and diagnostic applications. In contrast with conventional probes, which contain little or no electronics, these new devices need to become “smart”: integrated circuits need to be integrated into the probe to interface in a pitch-matched fashion with the many transducer elements (typically 1000+) needed for real-time 3D imaging. This chapter discusses the challenges associated with the design of such pitch-matched integrated circuits, focusing on strategies for channel-count reduction, beamforming, and digitization. The chapter includes a case study of a state-of-the-art catheter-based design for high-frame-rate 3D intracardiac imaging.

This article presents an application-specific integrated circuit (ASIC) for battery-powered ultrasound (US) devices. The ASIC implements a novel energy-efficient high-voltage (HV) pulser that generates HV transmit (TX) pulses directly from a low-voltage (LV) battery supply. By means of a single off-chip inductor, energy is supplied to a US transducer in a resonant fashion, directly generating half-period sinusoidal HV pulses on the transducer, while consuming substantially less energy than a conventional class-D pulser. By recycling residual reactive energy from the transducer back to the input, the energy consumption is further reduced by more than 50%. The autocalibration techniques are leveraged to deal with tolerances of the inductor, transducer, and battery supply and thus maximize the energy efficiency. A prototype chip was fabricated in TSMC 0.18-μm HV BCD technology and used to drive external 120-pF capacitive micromachined US transducers (CMUTs) with a center frequency of approximately 2.5 MHz. Electrical measurements show that the prototype can generate pulses with a peak amplitude between 10 and 30 V accurate to within ±1 V. Acoustic measurements demonstrate successful ultrasonic pulse transmission and pulse-echo measurements. The prototype reaches a peak efficiency of 0.23 fCV ² , which is the highest reported to date for HV pulsers targeting US imaging.

This article presents a low-power and small-area transceiver application-specific integrated circuit (ASIC) for 3-D trans-fontanelle ultrasonography. A novel micro-beamforming receiver architecture that employs current-mode summation and boxcar integration is used to realize delay-and-sum on an N -element sub-array using N× fewer capacitive memory elements than conventional micro-beamforming implementations, thus reducing the hardware overhead associated with the memory elements. The boxcar integration also obviates the need for explicit anti-aliasing filtering in the analog front end, thus further reducing die area. These features facilitate the use of micro-beamforming in smaller pitch applications, as demonstrated by a prototype transceiver ASIC employing micro-beamforming on sub-arrays of N=4 elements, targeting a wearable ultrasound device that monitors brain perfusion in preterm infants via the fontanel. To meet its strict spatial resolution requirements, a 10-MHz 100- μ m-pitch piezoelectric transducer array is employed, leading to a per-element die area > 2 × smaller than prior designs employing micro-beamforming.

This paper presents a pitch-matched transceiver ASIC integrated with a 2-D transducer array for a wearable ultrasound device for transfontanelle ultrasonography. The ASIC combines 8-fold multiplexing, 4-channel micro-beamforming (μ BF) and sub-array-level digitization to achieve a 128-fold channel-count reduction. The μ BF is based on passive boxcar integration and interfaces with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link concatenates outputs of four ADCs, leading to an aggregate 3.84 Gb/s data rate. Per channel, the RX circuit consumes 2.06 mW and occupies 0.05 mm2.

In this letter, a compact high-voltage (HV) transmit circuit for dense 2-D transducer arrays used in 3-D ultrasonic imaging systems is presented. Stringent area requirements are addressed by a unipolar pulser with embedded transmit/receive switch. Combined with a capacitive HV level shifter, it forms the ultrasonic HV transmit circuit with the lowest reported HV transistor count and area without any static power consumption. The balanced latched-based level shifter implementation makes the design insensitive to transients on the HV supply caused by pulsing, facilitating application in probes with limited local supply decoupling, such as imaging catheters. Favorable scaling through resource sharing benefits massively arrayed architectures while preserving full individual functionality. A prototype of 8 × 9 elements was fabricated in the TSMC 0.18 μm HV BCD technology and a 160μm×160μm PZT transducer matrix is manufactured on the chip. The system is designed to drive 65-V peak-to-peak pulses on 2-pF transducer capacitance and hardware sharing of six elements allows for an area of only 0.008 mm2 per element. Electrical characterization as well as acoustic results obtained with the 6-MHz central frequency transducer are demonstrated.

High frame rate three-dimensional (3D) ultrasound imaging would offer excellent possibilities for the accurate assessment of carotid artery diseases. This calls for a matrix transducer with a large aperture and a vast number of elements. Such a matrix transducer should be interfaced with an application-specific integrated circuit (ASIC) for channel reduction. However, the fabrication of such a transducer integrated with one very large ASIC is very challenging and expensive. In this study, we develop a prototype matrix transducer mounted on top of multiple identical ASICs in a tiled configuration. The matrix was designed to have 7680 piezoelectric elements with a pitch of 300 μm × 150 μm integrated with an array of 8 × 1 tiled ASICs. The performance of the prototype is characterized by a series of measurements. The transducer exhibits a uniform behavior with the majority of the elements working within the −6 dB sensitivity range. In transmit, the individual elements show a center frequency of 7.5 MHz, a −6 dB bandwidth of 45%, and a transmit efficiency of 30 Pa/V at 200 mm. In receive, the dynamic range is 81 dB, and the minimum detectable pressure is 60 Pa per element. To demonstrate the imaging capabilities, we acquired 3D images using a commercial wire phantom.

Three-dimensional ultrasound has initially been used to address volumetric imaging for diagnostic purposes and represents the leading-edge technological orientation in both transducer and IC (integrated circuit) architecture and design. However, new applications are coming up like biomarker measurements, preoperative navigation, real time surgery guidance or therapeutic procedures where 3D ultrasound modalities are key but their design objectives may need to be thought outside 3D echocardiography and radiology technological trade-offs. For those new applications, system architectures would need less complexity and imaging performances enabling easier hardware reconfigurability tailored to application-oriented imaging. This paper presents an ongoing development where a large matrix transducer has been assembled with multiple ASIC dies in a reconfigurable way. The transducer has a central frequency of 8MHz, a square pitch of 150μm× 150μm capable to fully image the upper carotid window thanks to a large aperture of 80×240 elements, resulting in a transducer active footprint of 12×36 square millimeters.

Over the past decades, ultrasound imaging has made considerable progress based on the advancement of imaging systems as well as transducer technology. With the need for advanced transducer arrays with complex designs and technical requirements, there is also a need for suitable tools to characterize such transducers. However, despite the importance of acoustic characterization to assess the performance of novel transducer arrays, the characterization process of highly complex transducers might involve various manual steps, which are laborious, time-consuming, and subject to errors. These factors can hinder the full characterization of a prototype transducer, leading to an under-representation or inadequate evaluation. To come to an extensive, high-quality evaluation of a prototype transducer, the acoustic characterization of each transducer element is indispensable in both transmit and receive operations. In this paper, we propose a pipeline to automatically perform the acoustic characterization of a matrix transducer using a research imaging system. The performance of the pipeline is tested on a prototype matrix transducer consisting of 960 elements. The results show that the proposed pipeline is capable of performing the complete acoustic characterization of a high-element count transducer in a fast and convenient way.

In this article, an application-specific integrated circuit (ASIC) for 3-D, high-frame-rate ultrasound imaging probes is presented. The design is the first to combine element-level, high-voltage (HV) transmitters and analog front-ends, subarray beamforming, and in-probe digitization in a scalable fashion for catheter-based probes. The integration challenge is met by a hybrid analog-to-digital converter (ADC), combining an efficient charge-sharing successive approximation register (SAR) first stage and a compact single-slope (SS) second stage. Application in large ultrasound imaging arrays is facilitated by directly interfacing the ADC with a charge-domain subarray beamformer, locally calibrating interstage gain errors and generating the SAR reference using a power-efficient local reference generator. Additional hardware-sharing between neighboring channels ultimately leads to the lowest reported area and power consumption across miniature ultrasound probe ADCs. A pitch-matched design is further enabled by an efficient split between the core circuitry and a periphery block, the latter including a datalink performing clock data recovery (CDR) and time-division multiplexing (TDM), which leads to a 12-fold total channel count reduction. A prototype of $8{\times }9$ elements was fabricated in a TSMC 0.18- $\mu \text{m}$ HV BCD technology and a 2-D PZT transducer matrix with a pitch of $160 \mu \text{m}$ , and a center frequency of 6 MHz was manufactured on the chip. The imaging device operates at up to 1000 volumes/s, generates 65-V transmit pulses, and has a receive power consumption of only 1.23 mW/element. The functionality has been demonstrated electrically as well as in acoustic and imaging experiments.