Transceiver ASIC Design for High-Frame-Rate 3D Intracardiac Echocardiography

Poster (2022)
Author(s)

Y.M. Hopf (TU Delft - Electrical Engineering, Mathematics and Computer Science)

B.W. Ossenkoppele (TU Delft - Applied Sciences, TU Delft - ImPhys/Medical Imaging)

E.C. Noothout (TU Delft - ImPhys/Medical Imaging)

Z.Y. Chang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

C. Chen (TU Delft - Electrical Engineering, Mathematics and Computer Science)

H.J. Vos (TU Delft - ImPhys/Medical Imaging, Erasmus Universiteit Rotterdam)

M.D. Verweij ( Erasmus Universiteit Rotterdam, TU Delft - ImPhys/Medical Imaging)

N. de Jong (TU Delft - ImPhys/Medical Imaging, Erasmus Universiteit Rotterdam)

M.A.P. Pertijs (TU Delft - Electrical Engineering, Mathematics and Computer Science)

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Research Group
Electronic Instrumentation
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Publication Year
2022
Language
English
Research Group
Electronic Instrumentation
Event
2022 IEEE International Ultrasonics Symposium (2022-10-10 - 2022-10-13), Venice, Italy
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Abstract

This work describes an ASIC design for high-frame-rate 3D intracardiac echocardiography probes. The chip is the first to combine element-level high-voltage pulsers and time-gain-compensation analog frontends as well as subarray beamformers and in-probe digitization in a pitch-matched fashion. The integration challenge is met by a shared hybrid beamforming ADC with the highest reported area and power efficiency. The achieved beamformer size of three elements enables acquisition at 1000 volumes/s while, in combination with a custom datalink, still providing sufficient channel-count reduction for catheter integration.

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