Development of a measurement system for wafer-level measurements
R.A. Buijvoets (TU Delft - Mechanical Engineering)
Jens Kober – Mentor (TU Delft - Learning & Autonomous Control)
R. Babuska – Graduation committee member (TU Delft - Learning & Autonomous Control)
G. Dunning – Mentor
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Abstract
This study presents the development and evaluation of an automated laser-based measurement system for determining the frequencies of Flexous oscillators while still in the wafer, using a Prusa I3 MK3 3D printer as a motion platform. Emphasis is placed on assessing the system's precision, repeatability, and edge detection accuracy. A lead screw-driven positioning mechanism with aluminium frame construction was designed to ensure high mechanical stability. Factors affecting positional accuracy, including microstepping, backlash, and structural deflection, are analysed and addressed. Calibration and homing tests confirmed sub-micrometre repeatability, with the Y-axis showing superior consistency. Movement accuracy tests revealed axis-dependent errors, influenced by mechanical and sensor-related factors. Edge detection performance was found to be sensitive to calibration speed, with slower movements significantly improving accuracy. The study concludes with recommendations for enhancing measurement precision through closed-loop control and predictive stopping logic, demonstrating the system’s potential for scalable, high-precision oscillator testing.