Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
Journal Article
(2015)
Author(s)
Y Liu (External organisation)
F Sun (External organisation)
Hang Zhang (External organisation)
T Xin (External organisation)
Cadmus Yuan (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1016/j.microrel.2015.05.005
To reference this document use:
https://resolver.tudelft.nl/uuid:da533de9-a5ea-443c-94a8-3daf704b9f7d
More Info
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Publication Year
2015
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
8
Volume number
55
Pages (from-to)
1234-1240
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