Is TSV-based 3D integration suitable for inter-die memory repair?
Conference Paper
(2013)
Author(s)
Mihai Lefter (TU Delft - Computer Engineering)
George Voicu (TU Delft - Computer Engineering)
Mottaqiallah Taouil (TU Delft - Computer Engineering)
M Enachescu (TU Delft - Computer Engineering)
Said Hamdioui (TU Delft - Computer Engineering)
Shao Ku Kao Cotofana (TU Delft - Computer Engineering)
Research Group
Computer Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:f482f4ba-2ffe-4f5f-8592-a81950b487ac
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Publication Year
2013
Language
English
Research Group
Computer Engineering
Pages (from-to)
1-4
ISBN (print)
978-3-9815370-0-0
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