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Automotive Application–driven Board Level Reliability Testing

Doctoral Thesis (2026)
Author(s)

V. Thukral (TU Delft - Electrical Engineering, Mathematics and Computer Science, NXP Semiconductors)

Contributor(s)

W.D. van Driel – Promotor (TU Delft - Electrical Engineering, Mathematics and Computer Science, TU Delft - Electrical Engineering, Mathematics and Computer Science)

G.Q. Zhang – Promotor (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.4233/uuid:f66542ff-64be-4827-a236-7e7469d68c31 Final published version
More Info
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Publication Year
2026
Language
English
Defense Date
01-09-2026
Awarding Institution
Delft University of Technology
Related content
Research Group
Electronic Components, Technology and Materials
ISBN (print)
978-94-6563-007-6
Downloads counter
17
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Abstract

This dissertation develops application-driven board level reliability experiments that reveal solder-board degradation mechanisms and convert measured degradation into AI-assissted prognostics for automotive electronics.

Files

TUD_Dissertation.pdf
(pdf | 17.2 Mb)
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File under embargo until 01-09-2027