Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Conference Paper (2023)
Author(s)

Leiming Du (TU Delft - Electronic Components, Technology and Materials)

Dong Hu (TU Delft - Electronic Components, Technology and Materials)

René Poelm (Nexperia)

Willem D. van Driel (Signify, TU Delft - Electronic Components, Technology and Materials)

Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2023 L. Du, D. Hu, René Poelm, W.D. van Driel, Kouchi Zhang
DOI related publication
https://doi.org/10.1109/EuroSimE56861.2023.10100756
More Info
expand_more
Publication Year
2023
Language
English
Copyright
© 2023 L. Du, D. Hu, René Poelm, W.D. van Driel, Kouchi Zhang
Research Group
Electronic Components, Technology and Materials
Bibliographical Note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.@en
Pages (from-to)
1-4
ISBN (print)
979-8-3503-4598-8
ISBN (electronic)
979-8-3503-4597-1
Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Abstract

The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress during its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential parameter for predicting fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will definitely cause a significant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.

Files

Micro_cantilever_Bending_Test_... (pdf)
(pdf | 0.584 Mb)
- Embargo expired in 17-10-2023
License info not available