Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Liu, Pan; Li, J.; van Zeijl, H.W.; Zhang, Kouchi

doi:10.1109/ECTC32862.2020.00133

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Title

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Author

Liu, Pan (Fudan University)
Li, J. (TU Delft Electronic Components, Technology and Materials)
van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

Contributor

O'Conner, L. (editor)

Date

2020

Abstract

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of sacrificial materials. A sacrificial layer was firstly placed on the surface of the transfer wafer, and the sandwich interconnect structures were then manufactured on top of the sacrificial layer. With the help of the sacrificial layer, the flexible interconnects were transferred to another wafer through wafer bonding process. Contact resistance structures were fabricated with the help of wafer bonding process, connecting and aligning metal contact layer on device wafer and metal layer embedded in transferred flexible interconnects. Such transferred contact resistance was measured through designed testing structures as a demo for wafer level heterogeneous integration.

Subject

flexible interconnect
heterogeneous integration
transferred interconnect

To reference this document use:

http://resolver.tudelft.nl/uuid:0afee5a5-cfa8-47bc-88db-180dfdfead1e

DOI

https://doi.org/10.1109/ECTC32862.2020.00133

Publisher

IEEE, Piscataway

ISBN

978-1-7281-6181-5

Source

2020 IEEE 70th Electronic Components and Technology Conference (ECTC): Proceedings