Print Email Facebook Twitter Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices Title Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices Author Zaal, J.J.M. Van Driel, W.D. Zhang, G.Q. Faculty Mechanical, Maritime and Materials Engineering Department Precision and Microsystems Engineering Date 2010-04-20 Abstract This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. Subject MEMSwafer level thin film packagepackagingresonator To reference this document use: http://resolver.tudelft.nl/uuid:166088ff-569f-4ed1-9e21-7dcaf8e6ad4f DOI https://doi.org/10.3390/s100403989 Publisher MDPI AG ISSN 1424-8220 Source Sensors, 10 (4), 2010 Part of collection Institutional Repository Document type journal article Rights (c) 2010 The Author(s)licensee MDPI, Basel, Switzerland. This article is an open-access articledistributed under the terms and conditions of the Creative Commons Attribution license(http://creativecommons.org/licenses/by/3.0/). Files PDF Zaal_2009.pdf 809.11 KB Close viewer /islandora/object/uuid:166088ff-569f-4ed1-9e21-7dcaf8e6ad4f/datastream/OBJ/view