Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

Gao, Hanyan (Fudan University)
Zhang, Jing (Heraeus Materials Technology)
Zhu, Yingcan (University of Southern Queensland)
Guo, Ruiqian (Fudan University)
Zhang, Wanlu (Fudan University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Liu, Pan (Fudan University; Research Institute of Fudan University, Ningbo; Yiwu Research Instiute of Fudan)

2022

With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation materials such as epoxy resins and silicone gels hardly bear temperatures above 200℃. Calcium aluminate cement (CAC) was proved to be a promising encapsulation material, which owns high thermal stability with its operating temperature of up to 300℃. Based on its satisfied thermal stability and low cost, the thermal conductivity of CAC was researched in this work with different ratios of 10-μm-sphere-Alumina (Al 2 O 3 ) fillers at different temperatures, which formed μm-scale CAC-Al 2 O 3 composites. In this work, we focused on the thermal conductivity of CAC-Al 2 O 3 composites aiming for encapsulation applications in power electronics packaging. The thermal conductivities of μm-scale CAC-Al 2 O 3 composites by the laser-flash method from room temperature to 350℃ were firstly measured. Results showed with an increasing content of fillers, the TC of CACAl 2 O 3 will increase accordinglyIt also illustrated that calcium aluminate cement was a high thermal stable encapsulation material with thermal conductivity over epoxy resins. Then, the Finite Element Model (FEM) was established and calibrated by experimental data for thermal conductivity simulation. The FEM model accuracy reached 90%. Such models for new filler materials are effective to minimize material development by actual experiments and characterizations, for CAC composite with different fillers. It also provides an alternative method in predicting other physical properties of composites such as coefficient of thermal expansion, porosity, etc.

Encapsulation
Finite element modeling
Cement
Thermal conductivity
Electronic packaging

http://resolver.tudelft.nl/uuid:f53ead41-a958-458f-8cbc-3e0097001d5b

https://doi.org/10.1109/ICEPT56209.2022.9873392

IEEE

2023-07-01

978-1-6654-9906-4

Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10 → 2022-08-13, Dalian, China

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2022 Hanyan Gao, Jing Zhang, Yingcan Zhu, Ruiqian Guo, Wanlu Zhang, Kouchi Zhang, Pan Liu