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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...conference paper 2023
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Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...conference paper 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023
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Zhang, H. (author), Berkhout, M. (author), Makinwa, K.A.A. (author), Fan, Q. (author)This article presents a digital-input class-D amplifier (CDA) achieving high dynamic range (DR) by employing a chopped capacitive feedback network and a capacitive digital-to-analog converter (DAC). Compared with conventional resistive-feedback CDAs driven by resistive or current-steering DACs, the proposed architecture eliminates the noise...journal article 2023
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Zhang, Yi (author), Si, Chundi (author), Fan, Taotao (author), Zhu, Yuefeng (author), Li, Song (author), Ren, S. (author), Lin, P. (author)With the increasing awareness of environmental protection and attention to resource reuse, the development of high-performance and degradable green biomass pavement materials attracts a lot of interest. Lignin and bio-oil effectively combined to play a synergistic role can improve various properties of asphalt and partially replace petroleum...journal article 2023
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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...conference paper 2023
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Wang, Hanyu (author), Chen, Dengkai (author), Huang, Y. (author), Zhang, Yahan (author), Qiao, Yidan (author), Xiao, Jianghao (author), Xie, Ning (author), Fan, Hao (author)This study aimed to enhance the real-time performance and accuracy of vigilance assessment by developing a hidden Markov model (HMM). Electrocardiogram (ECG) signals were collected and processed to remove noise and baseline drift. A group of 20 volunteers participated in the study. Their heart rate variability (HRV) was measured to train...journal article 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023
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Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author)This paper investigates thermomigration (TM) and electromigration (EM) in SWEAT structure. Firstly, the distribution of temperature along SWEAT structure during EM is obtained by using finite element (FE) simulation. The FE simulation results show that the temperature is almost uniformly distributed in the most region of narrow line in SWEAT...conference paper 2023
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Tang, Zhuorui (author), Tian, Jing (author), Mao, Chaobin (author), Zhang, Nan (author), Huang, Jiyu (author), Fan, J. (author), Zhang, Kouchi (author)Silicon carbide (SiC) epitaxial process is a key step in the fabrication of power devices, and the temperature field inside the reactor chamber plays an essential role in this process. In this paper, the temperature field in the horizontal chemical-vapor-deposition reactor chamber used for growing homo-epitaxial 4H-SiC material is studied using...conference paper 2023
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Chen, Wei (author), Jiang, Jing (author), Meda, Abdulmelik H. (author), Ibrahim, Mesfin S. (author), Zhang, Kouchi (author), Fan, J. (author)SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...journal article 2023
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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...journal article 2023
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Zhang, H. (author), Berkhout, Marco (author), Makinwa, K.A.A. (author), Fan, Q. (author)Class-D amplifiers (CDAs) are widely used in audio applications where a high power efficiency is required. As most audio sources are digital nowadays, implementing digital-input CDAs results in higher levels of integration and lower cost. However, prior open-loop digital-input CDAs suffer from high jitter sensitivity and output-stage...conference paper 2023
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Zhang, H. (author), Rozsa, N.N.M. (author), Berkhout, Marco (author), Fan, Q. (author)The power supply rejection ratio (PSRR) of conventional differential closed-loop Class-D amplifiers is limited by the feedback and input resistor mismatch and finite common-mode rejection ratio (CMRR) of the operational transconductance amplifier (OTA) in the first integrator. This article presents a 14.4-V Class-D amplifier employing...journal article 2022
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Zhang, H. (author), Berkhout, Marco (author), Makinwa, K.A.A. (author), Fan, Q. (author)Class-D amplifiers (CDAs) are often used in audio applications due to their superior power efficiency. Due to the sensitivity of the human ear, a large dynamic range (DR) is desired, and audio DACs with up to 130dB DR are commercially available [1]. However, the DR of the CDAs they drive is typically much lower [2]-[4], mainly due to the...conference paper 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...conference paper 2022
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...journal article 2022