Wind Resource Analysis For Airborne Wind Energy Systems

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

FedKNOW: Federated Continual Learning with Signature Task Knowledge Integration at Edge

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

Machine learning assisted early anomaly detection of LEDs with spectral power distribution modeling

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

EdgeVisionBench: A Benchmark of Evolving Input Domains for Vision Applications at Edge

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

Visualisation of the airflow pattern of exhaled droplets in a classroom

A 5GS/s 360MHz-BW 68dB-DR Continuous-Time 1-1-1 Filtering MASH ΔΣ ADC in 40nm CMOS

Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

High-Voltage and High-Current IGBT Press-pack Module for Power Grid

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

Review of Laser Sintering of Nanosilver Pastes for Die Attachment: Technologies and Trends