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Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints
A study of graphene nanoribbon-based gate performance robustness under temperature variations
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