Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study

A neural network-assisted 3D theoretical thermoelastic solution for laminated liquid crystal elastomer plate used in restoring cardiac mechanical function

Negative Effects of Inorganic Salt Invasion on the Dissociation Kinetics of Silica-Confined Gas Hydrate via Thermal Stimulation

A Chopper Class-D Amplifier for PSRR Improvement Over the Entire Audio Band

Prediction of mechanical solutions for a laminated LCEs system fusing an analytical model and neural networks

Railway ballast material selection and evaluation: A review

Modification on the chloride binding capacity of alkali activated slag by applying calcium and aluminium containing phases

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

Parametric studies on the water impact of one and twin free-falling wedges by a Cartesian grid multiphase flow model

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

The COVID-19 paradox of online collaborative education: when you cannot physically meet, you need more social interactions

A - 121.5-dB THD Class-D Audio Amplifier With 49-dB LC Filter Nonlinearity Suppression

A Comprehensive Study on the Rejuvenation Efficiency of Compound Rejuvenators for the Characterization of the Bituminous Binder, Mortar, and Mixture

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

Advances on methane reforming in solid oxide fuel cells

A 121.4-dB DR Capacitively Coupled Chopper Class-D Audio Amplifier

A − 91 dB THD + N, Class-D Piezoelectric Speaker Driver Using Dual Voltage/Current Feedback for Resistor-Less LC Resonance Damping

SOLEIL: Single-objective lens inclined light sheet localization microscopy

Implementation of Fully Coupled Electromigration Theory in COMSOL

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging