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- Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
- Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
- Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
- Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
- CO2-induced switching between MOF-based bio-mimic slow anion channel and proton pump for medical exhalation detection
- Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
- Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore
- Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
- Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag
- A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
- Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
- Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
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