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Liu, Minne (author), Li, Wenyu (author), Chen, Wei (author), Ibrahim, Mesfin S. (author), Xiong, Jingkang (author), Zhang, Kouchi (author), Fan, Jiajie (author)During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Wang, Xinyue (author), Chen, Haixue (author), Yang, Zhoudong (author), Liu, Wenting (author), Zeng, Zejun (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, Jiajie (author), Liu, Pan (author)With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through...journal article 2024
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Wang, Hanyu (author), Chen, Dengkai (author), Huang, Y. (author), Zhang, Yahan (author), Qiao, Yidan (author), Xiao, Jianghao (author), Xie, Ning (author), Fan, Hao (author)This study aimed to enhance the real-time performance and accuracy of vigilance assessment by developing a hidden Markov model (HMM). Electrocardiogram (ECG) signals were collected and processed to remove noise and baseline drift. A group of 20 volunteers participated in the study. Their heart rate variability (HRV) was measured to train...journal article 2023
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Chen, Wei (author), Jiang, Jing (author), Meda, Abdulmelik H. (author), Ibrahim, Mesfin S. (author), Zhang, Kouchi (author), Fan, J. (author)SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...journal article 2023
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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...journal article 2023
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...journal article 2022
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Cao, Yixing (author), Chen, Wei (author), Du, Yunjia (author), Qi, Gaojin (author), Santos, Thebano (author), Zhang, Kouchi (author), Fan, J. (author)YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...journal article 2022
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Jiang, Peng (author), Fu, Xiuju (author), Fan, Yee Van (author), Klemeš, Jiří Jaromír (author), Chen, P. (author), Ma, Stefan (author), Zhang, Wanbing (author)Coronavirus disease-2019 (COVID-19) poses a significant threat to the population and urban sustainability worldwide. The surge mitigation is complicated and associates many factors, including the pandemic status, policy, socioeconomics and resident behaviours. Modelling and analytics with spatial-temporal big urban data are required to assist...journal article 2021
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Cao, Yixing (author), Chen, Shanghuan (author), Li, Yutong (author), Du, Yunjia (author), Chen, Wei (author), Fan, J. (author), Zhang, Kouchi (author)The emission spectra of high color rendering phosphors, mixed with the yttrium aluminium garnet, silicon based oxynitride and nitride based phosphors, were predicted by the Lambert-Beer theory and back propagation neural network (BP NN). Firstly, the modified Lambert-Beer model was used to calculate the proportional coefficient of the...journal article 2021
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Fan, J. (author), Chen, Wei (author), Yuan, Weiyi (author), Fan, X. (author), Zhang, Kouchi (author)Light-emitting diode (LED) arrays have attracted increased attention in the area of high power intelligent automotive headlamps because of their superiority in disposing of the power limit of an individual LED package and controllably luminous intensity and illumination pattern. The optical and chromatic performances of an LED array do not...journal article 2020
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Chen, Wei (author), Fan, J. (author), Qian, Cheng (author), Pu, Bin (author), Fan, Xuejun (author), Zhang, Kouchi (author)The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...journal article 2019
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Yang, Ning (author), Yang, Daoguo (author), Zhang, Kouchi (author), Chen, Liangbiao (author), Liu, Dongjing (author), Cai, Miao (author), Fan, Xuejun (author)The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has...journal article 2018
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Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian-Ping (author), Qian, Cheng (author), Fan, Xue-Jun (author), Zhang, Kouchi (author)In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...journal article 2017
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Tang, H. (author), Ye, H. (author), Wong, K.Y. (author), Leung, Stanley Y.Y. (author), Fan, Jiajie (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...journal article 2017
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Chen, Liangbiao (author), Zhou, Jiang (author), Chu, Hsing-wei (author), Zhang, Kouchi (author), Fan, Xuejun (author)While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...journal article 2017
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Chen, Xianping (author), Ye, H. (author), Fan, Xuejun (author), Ren, Tianling (author), Zhang, Kouchi (author)Heat pipes (HPs) have received considerable attention in recent decades, especially in the field of cooling electronics, which requires the removal of added heat from an area of limited volume to the environment. Small HPs are widely used in electronic applications, which are normally limited by the compact structure and dimensions of the...journal article 2016
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Ye, H. (author), Leung, Stanley Y.Y. (author), Wong, K.Y. (author), Chen, Xianping (author), Lin, Kai (author), Fan, J. (author), Kjelstrup, Signe (author), Fan, Xuejun (author), Zhang, Kouchi (author)Using the analogue of the electric inductance, we reveal the properties of the thermal inductance in GaN-based light-emitting diode devices by testing their transient thermal behaviors. We find that the devices exhibit a transient thermal response under step-down or step-up currents and observe notable inductive phenomena of the temperature...journal article 2016