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Özkayar, G. (author), Lötters, J.C. (author), Tichem, M. (author), Ghatkesar, M.K. (author)
Piezoelectric micropumps enable miniaturization in microfluidics for lab-on-a-chip applications such as Organs-on-chips (OoC). However, achieving a steady flow with these micropumps is a significant challenge because of the reciprocating motion of the displacing component. Although dampers are widely preferred for reducing ripples, they are not...
conference paper 2022
document
Gunda, Arun (author), Özkayar, G. (author), Tichem, M. (author), Ghatkesar, M.K. (author)
Microvalves are important flow-control components in many standalone and integrated microfluidic circuits. Although there is a large body of work regarding<br/>microvalves, there is still a need for an easyto-fabricate, small-footprint, low-power device that can control both liquids and gases at moderate pressures. This paper details the...
conference paper 2019
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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
document
Peters, T.J. (author), Tichem, M. (author)
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...
conference paper 2016
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Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016
document
Peters, T.J. (author), Tichem, M. (author)
conference paper 2016
document
Peters, T.J. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated circuits (PICs) using flexible photonic waveguides on one of the PICs that are positionable by integrated micro electro mechanical system (MEMS) actuators. The concept aims for high precision and high degree of assembly process automation. The...
conference paper 2014
document
Van Gurp, J.F.C. (author), Tichem, M. (author), Staufer, U. (author)
Passive alignment of photonic components is an assembly method compatible with a high production volume. Its precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to...
conference paper 2011
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