Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Degradation of silicone-based sealing materials used in microelectronics

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Degradation and Failures of Polymers Used in Light-Emitting Diodes

Outlook: From Physics of Failure to Physics of Degradation

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

In-situ reliability monitoring of power packages using a Thermal Test Chip