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Zhang, D. (author), Zhang, L. (author), Verschuur, D.J. (author)
Ground penetrating radar (GPR) is a commonly used technology for identifying and examining ice. The low electrical conductivity and the uniformity of ice covers provide GPR with exceptional signal penetration and, thus, the ability to reveal the internal layers of glaciers. To extract the necessary information, wavefield separation and imaging...
conference paper 2024
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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...
conference paper 2023
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Broere, W. (author), Zhang, X. (author)
Daily and seasonal deformation behavior of immersed tunnels potentially impacts the structural integrity. In this study, distributed optical fiber sensors (DOFS) are used to instrument both dilation and immersion joints of the Heinenoordtunnel, an immersed tunnel in the Netherlands. This DOFS system proves capable of measuring joint opening and...
conference paper 2023
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Zhang, D. (author), Verschuur, D.J. (author)
Seismic data interpolation is a topic well suited for deep learning (DL) applications. Scaling operation-based DL neural networks, e.g., U-Net, have been popular since its booming development in the field of seismic data processing. Although many successful studies using U-Net on seismic data, scientists start to realize the downside of its...
conference paper 2023
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Kavoura, Dr. Florentia (author), Zhang, Y. (author), Veljkovic, M. (author)
The building sector is actively researching and reviewing technical solutions for de-construction, driven by the increasing importance of sustainability requirements, as outlined in the EU Commission's ‘Green Deal,‘ which aims to achieve net-zero greenhouse gas emissions by 2050. Two key research areas in efficient structural design strategies...
conference paper 2023
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Rutten, J. (author), Tissier, M.F.S. (author), Zhang, Xinyi (author), Reniers, A.J.H.M. (author), van Wiechen, P.P.J. (author), de Vries, S. (author), Rijnsdorp, D.P. (author), Mol, Jan Willem (author), Wilmink, Rinse (author)
Infragravity (IG) waves are key drivers for coastal erosion and thus need to be properly included in process-based modelling of coastal hazards. Uncertainties remain regarding the offshore boundary conditions for these long waves. Typically, only bound IG waves are included at the boundary, which means that the possible contribution of free IG...
conference paper 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Zhang, J. (author), Gallo, A.J. (author), Ferrari, Riccardo M.G. (author)
Multiplicative watermarking (MWM) is an active diagnosis technique for the detection of highly sophisticated attacks, but is vulnerable to malicious agents that use eaves-dropped data to identify and then remove or replicate the watermark. In this work, we propose a scheme to protect the parameters of MWM, by proposing a design strategy based...
conference paper 2023
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Chen, Wei (author), Yan, Xuyang (author), Ibrahim, Mesfin S. (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...
conference paper 2023
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Ruzzi, Alessandro (author), Shi, X. (author), Wang, Xi (author), Li, Gengyan (author), De Mello, Shalini (author), Chang, Hyung Jin (author), Zhang, X. (author), Hilliges, Otmar (author)
We propose GazeNeRF, a 3D-aware method for the task of gaze redirection. Existing gaze redirection methods operate on 2D images and struggle to generate 3D consistent results. Instead, we build on the intuition that the face region and eyeballs are separate 3D structures that move in a coordinated yet independent fashion. Our method leverages...
conference paper 2023
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Zhang, Xiaoyu (author), Li, Jianping (author), Chi, Po Wei (author), Chandrasegaran, R.S.K. (author), Ma, Kwan Liu (author)
With the most advanced natural language processing and artificial intelligence approaches, effective summarization of long and multi-topic documents - such as academic papers - for readers from different domains still remains a challenge. To address this, we introduce ConceptEVA, a mixed-initiative approach to generate, evaluate, and...
conference paper 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the...
conference paper 2023
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Zhang, Li (author), Dong, Y. (author), Farah, H. (author), van Arem, B. (author)
The gradual deployment of automated vehicles (AVs) results in mixed traffic where AVs will interact with human-driven vehicles (HDVs). Thus, social-aware motion planning and control while considering interactions with HDVs on the road is critical for AVs' deployment and safe driving under various maneuvers. Previous research mostly focuses on...
conference paper 2023
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Zhang, L. (author), Han, S. (author), Grammatico, S. (author)
In this paper, we propose a novel behavior planner that combines game theory with search-based planning for automated lane merging. Specifically, inspired by human drivers, we model the interaction between vehicles as a gap selection process. To overcome the challenge of multi-modal behavior exhibited by the surrounding vehicles, we formulate...
conference paper 2023
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Mo, J. (author), Shankar, S. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Fabricating high-aspect-ratio (HAR) structures with silicon carbide (SiC) is a challenging task. This paper presents a silicon carbide (SiC) reinforced vertically aligned carbon nanotubes (VACNT) composite as a promising candidate to fabricate HAR MEMS devices for harsh environment applications. The use of a VACNT array allows the fast...
conference paper 2023
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...
conference paper 2023
document
Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...
conference paper 2023
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)
Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...
conference paper 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...
conference paper 2023
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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
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